CO-PA Hot Melt Film 29MM Width Polyamide Hot Melt Adhesive Tape for SIM Card
Hot Melt Adhesive Tape
The hot melt adhesive tape is utilized for embedding contact smart cards. The hot melt adhesive tape exhibits excellent adhesion to PVC, FR-4, and various other materials. This particular product falls under the category of hot-melt tape with low and medium temperature properties. The hot melt adhesive tape possesses high cohesion and favorable flexibility, ensuring that no structural fractures occur during thrust and bending tests after bonding. Additionally, The hot melt adhesive tape maintains a well-balanced bond strength with the chip and card base while exhibiting excellent punchability. The hot melt adhesive tape meets the requirements of ISO7816 standard for chip package durability.
The Characteristics of Hot Melt Adhesive Tape
1.Strong adhesion: hot melt adhesive tape effectively bonds to various materials, including plastics, metals, and textiles.
2.Excellent temperature resistance: hot melt adhesive tape exhibits high temperature resistance, maintaining stable adhesive properties even in high-temperature environments.
3.Superior flexibility: hot melt adhesive tape demonstrates good flexibility, allowing it to adapt to different shapes and curved surfaces for bonding requirements.
4.Chemical resistance: hot melt adhesive tape withstands the corrosion of many chemicals, exhibiting good resistance to corrosion.
5.High production efficiency: hot melt adhesive tape has a fast melting and curing speed, enhancing production efficiency and reducing manufacturing costs.
The Physical Characteristics of Hot Melt Adhesive Tape
Physical Characteristics
| Color | Light Yellow |
| Release Layer | Glassine Release Paper |
| Conventional Thickness | 0.055mm±0.008mm |
| Conventional Width | 29mm |
| Finished Product | 0.055mm*29mm*200m |
| Proportion | 1.08±0.02g/cm³ |
| Hardness | D58±2 ( Shore ) |
| Melt Flow Index | 75±25g/10mins (ASTM D1238-04) |
| Melting Range | 65-95 ℃ (ISO11357) |
| TG Temperature | 8±5℃ (GB/T 19466.2-2004) |
Recommended Bonding Conditions
| First Lamination | Second Implanting |
| Mechanical Mold Temperature | 140℃-160℃ | Mechanical Mold Temperature | 160℃-180℃ |
| Hot Pressing Time | 0.6-1.2 seconds | Hot Pressing Time | 0.6-1.2 seconds |
| Pressure | 0.25-0.4mpa | Pressure | 0.25-0.4mpa |
The Application of Hot Melt Adhsive Tape
1.Packaging: PA hot melt adhesive tape is used for sealing cartons, boxes, and packages. PA hot melt adhesive tape provides strong adhesion and secure bonding, ensuring the integrity and safety of the packaged items.
2.Product assembly: PA hot melt adhesive tape is employed in the assembly of various products, such as electronics, appliances, automotive components, and furniture. PA hot melt adhesive tape securely bonds different materials together, providing structural strength and stability.
3.Labeling and bonding: PA hot melt adhesive tape is used for attaching labels, tags, and promotional materials to products or packaging. PA hot melt adhesive tape offers reliable adhesion and long-lasting bonding, even in challenging environments.
PA Hot Melt Adhesive Tape's Customer Feedback
PA Hot Melt Adhesive Tape
Packing & Shipping :
Packing: 100 yard in roll, 2 rolls in case
Shipping: 5-7days by Express (DHL, FedEx, USP and so on) and by air, and 30-40 days by sea.
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Co Pa 29mm Width Hot Melt Adhesive Tape Polyamide For Sim Card Images
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